ISD-T360SB Datasheet, PDF (14/109 Pages) List of Unclassifed Manufacturers – VoiceDSP Digital Speech Processor with Master/Slave, Full-Duplex Speakerphone, Multiple Flash and ARAM/DRAM Support

ISD-T360SB
Figure 1-6: 5 V Power Connection Diagram
C₆
R₂
C₅
V_SS V_CC V_CC V_CCA
V_SS C₇
74
V_{SS 9}
72
64
63
61
60
V_SSA
5 V Supply
C₂
V_CCHI ₁₁
ISD-T360
50 ^VSS
V_{CC 12}
30
V_CC
C₄
48
32
V_CC
V_SS
C₃
1—HARDWARE
For optimal noise immunity, the power and
ground pins should be connected to V_CC and
the ground planes, respectively, on the printed
circuit board. If V_CC and the ground planes are
not used, single conductors should be run direct-
ly from each V_CC pin to a power point, and from
each GND pin to a ground point. Avoid daisy-
chained connections. The VoiceDSP does not
perform its usual functions in power-down mode
but it still preserves stored messages, maintains
the time of day and generates ARAM/DRAM re-
fresh cycles.
When you build a prototype, using wire-wrap or
other methods, solder the capacitors directly to
the power pins of the VoiceDSP processor sock-
et, or as close as possible, with very short leads.
1.2.5 MEMORY INTERFACE
Flash Support
The ISD-T360SB VoiceDSP supports Flash devices
for storing recorded data, thus, power can be
disconnected to the ISD-T360SB without losing
data. The ISD-T360SB supports serial and semi-
parallel Flash device interfaces, such as
TC58V16BFT, TC5816BFT, TC58A040F, KM29N040T,
KM2928000T/IT, and KM29216000AT/AIT. The ISD-
T360SB may be connected to up to four Flash de-
vices, resulting with maximum recording storage
of 16-Mbits x 4 = 64 Mbits (up to 4 hours of record-
ing time).
The following flash devices are supported:
1-6
Voice Solutions in Silicon^™