405EZ Datasheet, PDF (42/54 Pages) Applied Micro Circuits Corporation – PowerPC 405EZ Embedded Processor

PPC405EZ – PowerPC 405EZ Embedded Processor
Revision 1.27 - August 22, 2007
Preliminary Data Sheet
Table 8. Package Thermal Specifications
The PPC405EZ is designed to operate within a case temperature range of -40°C to +105°C. Thermal resistance values for the
EPBGA packages in a convection environment are as follows:
Parameter
Symbol
0 (0)
Airflow
ft/min (m/sec)
Unit
100 (0.51) 200 (1.02) 300 (1.52) 400 (2.02) 600 (3.03)
Junction-to-ambient thermal resistance
without heat sink
θ_JA
29.3
24.1
22.9
22.4
22.0
21.6
°C/W
Junction-to-ambient thermal resistance
with heat sink
θ_JA
22.7
14.3
12.3
11.5
11.1
10.7
°C/W
Resistance Value
Junction-to-case thermal resistance
θ_JC
11.9
°C/W
Junction-to-board thermal resistance
θ_JB
16.4
°C/W
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, T_C, is measured at top center of case surface with device soldered to circuit board.
b. T_A = T_C – Pxθ_CA, where T_A is ambient temperature and P is power consumption.
c. T_CMax = T_JMax – Pxθ_JC, where T_JMax is maximum junction temperature and P is power consumption.
3. Values with a heat sink were achieved with a 38.1mm x 38.1mm x 16.5mm unit, attached to the chip using a 0.1mm thickness of
adhesive having a thermal conductivity of 1.3W/mK.
Thermal Management
The following heat sink was used in the above thermal analysis:
Aavid Thermalloy, PN 79985
The heat sink is manufactured by:
Aavid Thermalloy
70 Commercial St.
Concord, NH 03301
USA
Tel: [phone]
URL: www.aavidthermalloy.com
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