W632GU6KB Datasheet, PDF (98/160 Pages) Winbond – 16M X 8 BANKS X 16 BIT DDR3L SDRAM

W632GU6KB
10. ELECTRICAL CHARACTERISTICS
10.1 Absolute Maximum Ratings
PARAMETER
SYMBOL
RATING
UNIT NOTES
Voltage on VDD pin relative to VSS
VDD
-0.4 ~ 1.975
V
1, 3
Voltage on VDDQ pin relative to VSS
VDDQ
-0.4 ~ 1.975
V
1, 3
Voltage on any pin relative to VSS
VIN, VOUT
-0.4 ~ 1.975
V
1
Storage Temperature
TSTG
-55 ~ 100
°C
1, 2
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions,
please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300 mV of each other at all times. VREFDQ and VREFCA must not greater than 0.6 x VDDQ.
When VDD and VDDQ are less than 500 mV, VREFDQ and VREFCA may be equal to or less than 300 mV.
10.2 Operating Temperature Condition
PARAMETER
SYMBOL RATING UNIT NOTES
0 ~ 85
°C
1, 2
Commercial Operating Temperature Range (for -11/-12/-15)
TOPER
0 ~95
°C
1, 2, 4
Industrial Operating Temperature Range (for -12I/15I)
-40 ~ 85
°C
TOPER
-40 ~ 95
°C
1, 3
1, 3, 4
Notes:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measurement
conditions, please refer to the JEDEC document JESD51-2.
2. During operation, the DRAM case temperature must be maintained between 0 to 95°C for Commercial parts under all
specification parameters.
3. During operation, the DRAM case temperature must be maintained between -40 to 95°C for Industrial parts under all
specification parameters
4. Some applications require operation of the 85°C < TCASE ≤ 95°C operating temperature. Full specifications are provided in
this range, but the following additional conditions apply:
(a) Refresh commands have to be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µS.
(b) If Self-Refresh operation is required in 85°C < TCASE ≤ 95°C operating temperature range, than it is mandatory to either
use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0_b and MR2 A7 = 1_b) or
enable the Auto Self-Refresh mode (ASR) (MR2 A6 = 1_b, MR2 A7 is don't care).
10.3 DC & AC Operating Conditions
10.3.1 Recommended DC Operating Conditions
SYM.
PARAMETER
MIN.
TYP. MAX.
VDD Supply Voltage
1.283
1.35
1.45
VDDQ Supply Voltage for Output
1.283
1.35
1.45
RZQ
External Calibration Resistor connected
from ZQ ball to ground
237.6
240.0
242.4
Notes:
1. Under all conditions VDDQ must be less than or equal to VDD.
2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
3. The external calibration resistor RZQ can be time-shared among DRAMs in special applications.
UNIT
V
V
Ω
NOTES
1, 2
1, 2
3
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Publication Release Date: Jan. 20, 2015
Revision: A06