W632GU6KB Datasheet, PDF (159/160 Pages) Winbond – 16M X 8 BANKS X 16 BIT DDR3L SDRAM

W632GU6KB
12. PACKAGE SPECIFICATION
Package Outline WBGA96 (9x13 mm², ball pitch: 0.8mm, Ø =0.45mm)
E1
A ^{// bbb C}
eE
A1
E
Pin A1 index
Pin A1 index
98 7
3 21
A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
96xΦb
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
ddd M C A B
eee M C
THE WINDOW-SIDE
ENCAPSULANT
SYMBOL
A
A1
b
D
E
D1
E1
eE
eD
aaa
bbb
ccc
ddd
eee
DIMENSION (MM)
MIN.
---
NOM.
---
MAX.
1.20
0.25
---
0.40
0.40
---
0.50
12.90 13.00
13.10
8.90
9.00
9.10
12.00 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
---
---
0.15
---
---
0.20
---
---
0.10
---
---
0.15
---
---
0.08
ccc C
C
SEATING PLANE
BALL LAND
1
BALL OPENING
Note:
1. Ball land: 0.5mm, Ball opening: 0.4mm, PCB Ball land
suggested ≤ 0.4mm
aaa C 4X
B
- 159 -
Publication Release Date: Jan. 20, 2015
Revision: A06