W83627HF Datasheet, PDF (185/185 Pages) Winbond – WINBOND I/O

W83627HF/F
18. PACKAGE DIMENSIONS
(128-pin QFP)
102
103
HE
E
65
64
D HD
128
1
e
b
See Detail F
Seating Plane
39
38
A
A2
A1
y
c
L
L1
Detail F
PRELIMINARY
Symbol
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Min
0.25
2.57
0.10
0.10
13.90
19.90
17.00
23.00
0.65
0
Dimension in mm
Nom
0.35
Max
0.45
2.72
2.87
0.20
0.30
0.15
0.20
14.00
14.10
20.00
0.50
20.10
17.20
23.20
0.80
1.60
17.40
23.40
0.95
0.08
7
Dimension in inch
Min Nom Max
0.010
0.101
0.014
0.107
0.018
0.113
0.004 0.008 0.012
0.004 0.006 0.008
0.547 0.551 0.555
0.783 0.787 0.791
0.020
0.669 0.677 0.685
0.905 0.913 0.921
0.025 0.031 0.037
0.063
0.003
0
7
Note:
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion .
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
on final visual inspection spec.
5. PCB layout please use the "mm".
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
- 167 -
Publication Release Date: Oct 1998
Revision 0.51