VSC7212 Datasheet, PDF (32/34 Pages) Vitesse Semiconductor Corporation – Gigabit Interconnect Chip

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Gigabit Interconnect Chip
Preliminary Data Sheet
VSC7212
Package Thermal Considerations
The VSC7212 is packaged in a 100-pin, 14x14x1.0mm, cavity-down, thermally-enhanced TQFP. This
package uses an industry-standard EIAJ footprint but has been enhanced to improve thermal dissipation. The
construction of the package is shown in Figure 23.
Figure 23: TQFP Package Cross Section
Plastic Molding Compound
Internal Heat Spreader
Insulator
Lead
Bond Wire
Die
Table 17: Thermal Resistance
Symbol
θ_ca
θ_ca-100
θ_ca-200
θ_ca-400
θ_ca-600
Description
Thermal resistance from case to ambient in still air including conduction
through the leads.
Thermal resistance from case to ambient with 100 LFM airflow
Thermal resistance from case to ambient with 200 LFM airflow
Thermal resistance from case to ambient with 400 LFM airflow
Thermal resistance from case to ambient with 600 LFM airflow
TQFP
39.9
37.1
35.3
33.5
31.7
Units
o_C/W
o_C/W
o_C/W
o_C/W
o_C/W
The VSC7212 is designed to operate with a case temperature up to 100^oC. The user must guarantee that the
case temperature specification is not violated. With the thermal resistances shown above, the 14mm thermally-
enhanced PQFP can operate in still air ambient temperatures of 52.1^oC [52.1^oC = 100^oC - 1.0W * 39.9]. If the
ambient air temperature exceeds these limits then some form of cooling through a heatsink or an increase in
airflow must be provided.
Moisture Sensitivity Level
This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC,
60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.
Page 32
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800)-VITESSE • FAX: [phone] • Email: [e-mail]
Internet: www.vitesse.com
G52268-0, Rev 3.3
04/10/01