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DS90UB929-Q1 Datasheet, PDF (8/71 Pages) Texas Instruments – 720p HDMI to FPD-Link III Bridge Serializer
DS90UB929-Q1
SNLS457 – NOVEMBER 2014
www.ti.com
7.4 Thermal Information
THERMAL METRIC(1)
VQFN
64 PINS
UNIT
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
25.8
11.4
5.1
°C/W
0.2
5.1
0.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8
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