LMG3410 Datasheet, PDF (4/33 Pages) Texas Instruments – 600-V 12-A Single Channel GaN Power Stage

LMG3410
SNOSD10A – APRIL 2016 – REVISED JUNE 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
V _DS
V _DD
I _DS
V _IN
T _STG
T_J
Drain-Source Voltage
Supply Voltage
Drain-Source Current, Pulsed
IN, LPM Pin Voltage
Storage Temperature
Operating Temperature
MIN
MAX
UNIT
600
V
–0.3
20
V
–32
32
A
5.5
V
–55
150
°C
–40
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins ⁽²⁾
VALUE
±1000
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DS
Drain-Source Voltage
V_DD
Supply Voltage
I_DS
DC Drain-Source Current
I_+5V
LDO External Load Current
T_J
Operating Temperature
MIN
NOM
9.5
12
-40
MAX
480
18
12
5
125
UNIT
V
V
A
mA
°C
6.4 Thermal Information
THERMAL METRIC ^{(1) (2)}
LMG3410
RWH (QFN)
UNIT
R _θJA
R _θJC(top)
R _θJC(bot)
Junction-to-ambient thermal resistance⁽³⁾
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
32 PINS
26.5
5.3
0.5
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
(3) The Theta_JA specification is based on a JEDEC 2s2p PCB using thermal vias in still air.
4
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