LMG3410 Datasheet, PDF (28/33 Pages) Texas Instruments – 600-V 12-A Single Channel GaN Power Stage

RWH0032A
B
PIN 1 INDEX AREA
PACKAGE OUTLINE
VQFN - 0.9 mm max height
SCALE 2.000
PLASTIC QUAD FLATPACK - NO LEAD
8.1
7.9
A
8.1
7.9
0.9 MAX
0.05
0.00
4X 0.85
11
2X
5.2
PKG SYMM
(2.75)
(0.65)
3.75 0.1
PKG
12
16
6.2 0.1
33
C
SEATING PLANE
(0.2) TYP
32X
0.65
0.55
17
4X
0.85
0.75
0.1 C A B
0.05 C
16X 0.65
1
32
4X 0.65
2X 1.3
PIN 1 ID
27
24X
0.45
0.35
0.1 C A B
0.05 C
28
4X
0.65
0.55
0.1 C A B
0.05 C
2X 2.85
4X 0.75
NOTES:
4221569/B 01/2016
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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