LMG3410 Datasheet, PDF (29/33 Pages) Texas Instruments – 600-V 12-A Single Channel GaN Power Stage

RWH0032A
4X (0.8) 1
(0.8) TYP
EXAMPLE BOARD LAYOUT
VQFN - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.75)
(1.875)
32
28
27
24X (0.4)
2X (1.05)
22X ( 0.2)
VIA
33
PKG SYMM
(0.595)
20X (0.65)
(1.19)
TYP
(7.6)
(6.2)
(0.4)
4X (0.85)
(0.8) TYP
17
11
(R0.05) TYP
0.05 MAX
ALL AROUND
12
(1.225)
PKG
PAD
(7.6)
2X (2.85)
LAND PATTERN EXAMPLE
SCALE:12X
METAL
0.05 MIN
ALL AROUND
16
4X (0.6)
4X (0.75)
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221569/B 01/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com