HD3SS3220_15 Datasheet, PDF (34/43 Pages) Texas Instruments – HD3SS3220 USB Type-C DRP Port Controller with SuperSpeed 2:1 MUX

HD3SS3220
SLLSES1 – DECEMBER 2015
www.ti.com
10.1.7 Surface-Mount Device Pad Discontinuity Mitigation
Avoid including surface-mount devices (SMDs) on high-speed signal traces because these devices introduce
discontinuities that can negatively affect signal quality. When SMDs are required on the signal traces (for
example, the USB SuperSpeed transmit AC coupling capacitors) the maximum permitted component size is
0603. TI strongly recommends using 0402 or smaller. Place these components symmetrically during the layout
process to ensure optimum signal quality and to minimize reflection. For examples of correct and incorrect AC
coupling capacitor placement, see Figure 19.
Figure 19. AC-Coupling Placement
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