5962-0924001VXC Datasheet, PDF (3/46 Pages) Texas Instruments – 12-Bit, 1-GSPS Analog-to-Digital Converter

ADS5400-SP
www.ti.com
SLAS669C – SEPTEMBER 2010 – REVISED AUGUST 2012
THERMAL CHARACTERISTICS⁽¹⁾
PARAMETER
R_θJA
R_θJC
TEST CONDITIONS
JESD51-2 and JESD51-3 ⁽²⁾
MIL-STD-883 Test Method 1012⁽³⁾
TYP
21.81
0.849
UNIT
°C/W
°C/W
(1) This CQFP package has built-in vias that electrically and thermally connect the bottom of the die to a pad on the bottom of the package.
To efficiently remove heat and provide a low-impedance ground path, a thermal land is required on the surface of the PCB directly
underneath the body of the package. During normal surface mount flow solder operations, the heat pad on the underside of the package
is soldered to this thermal land creating an efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it
that provide a thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat removal. TI
typically recommends an 11,9 mm2 board-mount thermal pad. This allows maximum area for thermal dissipation, while keeping leads
away from the pad area to prevent solder bridging. A sufficient quantity of thermal/electrical vias must be included to keep the device
within recommended operating conditions. This pad must be electrically at ground potential.
(2) R_θJA is the thermal resistance from the junction to ambient.
(3) R_θJC is the thermal resistance from the junction to case.
RECOMMENDED OPERATING CONDITIONS
SUPPLIES
Analog supply voltage, AVDD5
Analog supply voltage, AVDD3
Digital supply voltage, DVDD3
ANALOG INPUT
Full-scale differential input range
V_CM
Input common mode
DIGITAL OUTPUT
Differential output load
CLOCK INPUT
CLK input sample rate (sine wave)
Clock amplitude, differential
Clock duty cycle
T_C
Operating case temperature
MIN
TYP
4.75
5
3.135
3.3
3.135
3.3
1.52
AVDD5/2
100
0.6
45%
–55
50%
MAX UNIT
5.25
V
3.465
V
3.465
V
2
V_pp
V
5
pF
1000
1.5
55%
125
MSPS
V_pp
°C
Copyright © 2010–2012, Texas Instruments Incorporated
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