CDC7005RGZT Datasheet, PDF (26/34 Pages) Texas Instruments – 3.3-V HIGH PERFORMANCE CLOCK SYNTHSIZER AND JITTER CLEANER

PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
CDC7005RGZ
CDC7005RGZR
CDC7005RGZRG4
CDC7005RGZT
CDC7005RGZTG4
CDC7005ZVA
CDC7005ZVAR
CDC7005ZVAT
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
PREVIEW VQFN
RGZ 48
TBD
ACTIVE
VQFN
RGZ 48 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGZ 48 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGZ 48 250 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGZ 48 250 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZVA 64 348
Pb-Free
(RoHS)
ACTIVE
BGA
ZVA 64 1000
Pb-Free
(RoHS)
ACTIVE
BGA
ZVA 64 250
Pb-Free
(RoHS)
Lead/Ball Finish
(6)
Call TI
CU NIPDAU | Call TI
Call TI
CU NIPDAU | Call TI
Call TI
SNAGCU
SNAGCU
SNAGCU
MSL Peak Temp Op Temp (°C)
(3)
Call TI
-40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
CDC7005
CDC7005
CDC7005
CDC7005
CK7005Z
CK7005Z
CK7005Z
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Addendum-Page 1
Samples