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CDC7005RGZT Datasheet, PDF (13/34 Pages) Texas Instruments – 3.3-V HIGH PERFORMANCE CLOCK SYNTHSIZER AND JITTER CLEANER
CDC7005
3.3ĆV HIGH PERFORMANCE CLOCK SYNTHESIZER AND JITTER CLEANER
SCAS685L− DECEMBER 2002 − REVISED JUNE 2009
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VCC, AVCC (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input current (VI < 0, VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output current for LVPECL outputs (0 < VO < VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Storage temperature range Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 2. All supply voltages must be the same value and must be supplied at the same time.
NOTES: 3. The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
package thermal resistance for RGZ (QFN) package (see Note 4 and Note 5)
AIRFLOW (LFM)
0
qJA (5C/W)
29.9
qJC (5C/W)
22.4
qJP (5C/W)
1.5
YJT (5C/W)
0.2
15
24.7
0.2
250
23.2
0.2
500
21.5
0.3
NOTE 4: The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
NOTE 5: Connected to GND with nine thermal vias (0,3 mm diameter).
package thermal resistance for ZVA (BGA) package (see Note 6)
AIRFLOW (m/s)
0
qJA (5C/W)
54
qJC (5C/W)
29.9
qJB (5C/W)
44.5
YJT (5C/W)
0.9
1
49
0.9
2.5
47.2
0.9
NOTE 6: The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
recommended operating conditions
MIN
NOM
MAX UNIT
Supply voltage, VCC
3
3.3
3.6 V
Operating free-air temperature, TA
−40
85 °C
Low-level input voltage LVCMOS, VIL
0.3 VCC V
High-level input voltage LVCMOS, VIH
0.7 VCC
V
Input threshold voltage LVCMOS, VIT
0.5 VCC
V
High-level output current LVCMOS, IOH
−6 mA
Low-level output current LVCMOS, IOL
6 mA
Input voltage range LVCMOS, VI
0
3.6 V
Input amplitude LVPECL, VINPP [(VVCXO_IN − VVCXO_INB), See Note 7]
0.5
1.3 V
Common-mode input voltage LVPECL, VIC
VCC−2
VCC−0.4
V
NOTE 7: VINPP minimum and maximum is required to maintain ac specifications; the actual device function tolerates at a minimum
VINPP of 100 mV.
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