PD178004A_15 Datasheet, PDF (49/58 Pages) Renesas Technology Corp – PD178004A_15

µPD178004A, 178006A, 178016A, 178018A
12. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 12-1. Surface Mounting Type Soldering Conditions
µPD178004AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178006AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178016AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178018AGC-×××-3B9 : 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above), IR35-00-3
Number of times: Three times max.
VPS
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above), VP15-00-3
Number of times: Three times max.
Wave soldering
Partial heating
Solder bath temperature : 260 °C max., Duration : 10 sec. max., Number of times
: once, Preheating temperature : 120 °C max.
(package surface temperature)
Pin temperature: 300 °C max. Duration: 3 sec. max. (per pin row)
WS60-00-1
—
Caution Do not use different soldering method together (except for partial heating).
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