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HYB18T512400B2C Datasheet, PDF (47/69 Pages) Qimonda AG – 512-Mbit Double-Data-Rate-Two SDRAM
Internet Data Sheet
HY[B/I]18T512[40/80/16]0B2[C/F](L)
512-Mbit Double-Data-Rate-Two SDRAM
33) When the device is operated with input clock jitter, this parameter needs to be derated by the actual tJIT.DUTY of the input clock. (output
deratings are relative to the SDRAM input clock.) For example, if the measured jitter into a DDR2–667 SDRAM has tJIT.DUTY.MIN = – 72 ps
and tJIT.DUTY.MAX = + 93 ps, then tRPST.MIN(DERATED) = tRPST.MIN + tJIT.DUTY.MIN = 0.4 x tCK.AVG – 72 ps = + 928 ps and tRPST.MAX(DERATED) = tRPST.MAX
+ tJIT.DUTY.MAX = 0.6 x tCK.AVG + 93 ps = + 1592 ps. (Caution on the MIN/MAX usage!).
34) For these parameters, the DDR2 SDRAM device is characterized and verified to support tnPARAM = RU{tPARAM / tCK.AVG}, which is in clock
cycles, assuming all input clock jitter specifications are satisfied. For example, the device will support tnRP = RU{tRP / tCK.AVG}, which is in
clock cycles, if all input clock jitter specifications are met. This means: For DDR2–667 5–5–5, of which tRP = 15 ns, the device will support
tnRP = RU{tRP / tCK.AVG} = 5, i.e. as long as the input clock jitter specifications are met, Precharge command at Tm and Active command at
Tm + 5 is valid even if (Tm + 5 - Tm) is less than 15 ns due to input clock jitter.
35) tWTR is at lease two clocks (2 x tCK) independent of operation frequency.
Parameter
TABLE 46
DRAM Component Timing Parameter by Speed Grade - DDR2–667
Symbol
DDR2–667
Unit
Note1)2)3)4)5)6)7)
DQ output access time from CK / CK
CAS to CAS command delay
Average clock high pulse width
Average clock period
CKE minimum pulse width ( high and low pulse
width)
tAC
tCCD
tCH.AVG
tCK.AVG
tCKE
Average clock low pulse width
Auto-Precharge write recovery + precharge time
Minimum time clocks remain ON after CKE
asynchronously drops LOW
tCL.AVG
tDAL
tDELAY
DQ and DM input hold time
tDH.BASE
DQ and DM input pulse width for each input
tDIPW
DQS output access time from CK / CK
tDQSCK
DQS input high pulse width
tDQSH
DQS input low pulse width
tDQSL
DQS-DQ skew for DQS & associated DQ signals tDQSQ
DQS latching rising transition to associated clock tDQSS
edges
DQ and DM input setup time
DQS falling edge hold time from CK
DQS falling edge to CK setup time
CK half pulse width
tDS.BASE
tDSH
tDSS
tHP
Data-out high-impedance time from CK / CK
tHZ
Address and control input hold time
tIH.BASE
Control & address input pulse width for each input tIPW
Address and control input setup time
tIS.BASE
DQ low impedance time from CK/CK
tLZ.DQ
DQS/DQS low-impedance time from CK / CK
tLZ.DQS
MRS command to ODT update delay
tMOD
Min.
–450
2
0.48
3000
3
Max.
+450
—
0.52
8000
—
0.48
WR + tnRP
tIS + tCK .AVG +
tIH
175
0.35
–400
0.35
0.35
—
– 0.25
0.52
—
––
––
—
+400
—
—
240
+ 0.25
100
0.2
0.2
Min(tCH.ABS,
tCL.ABS)
—
275
0.6
200
2 x tAC.MIN
tAC.MIN
0
––
—
—
__
tAC.MAX
—
—
—
tAC.MAX
tAC.MAX
12
ps
8)
nCK
tCK.AVG
ps
nCK
9)10)
11)
tCK.AVG
nCK
ns
9)10)
12)13)
ps
tCK.AVG
ps
tCK.AVG
tCK.AVG
ps
tCK.AVG
18)19)14)
8)
15)
16)
ps
tCK.AVG
tCK.AVG
ps
17)18)19)
16)
16)
20)
ps
ps
tCK.AVG
ps
ps
ps
ns
8)21)
24)22)
23)24)
8)21)
8)21)
34)
Rev. 1.12, 2007-05
47
10062006-YPTZ-CDR7