AR0833 Datasheet, PDF (63/64 Pages) ON Semiconductor – 8 Mp CMOS Digital Image Sensor

AR0833: 1/3.2-Inch 8 Mp CMOS Digital Image Sensor
Revision History
Revision History
Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/10/15
• Updated “Ordering Information” on page 2
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/9/15
• Converted to ON Semiconductor template
• Removed Confidential marking
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/2/13
• Updated Table 2, “Modes of Operation and Power Consumption at 100% FOV,” on
page 2
• Updated number of pads in first paragraph of “Signal Descriptions” on page 9
• Updated Figure 16: “HDR Integration Time,” on page 28
• Deleted third paragraph of “Using Global Reset with SMIA Data Path” on page 53
• Updated Table 23, “DC Electrical Definitions and Characteristics,” on page 62 (also
changed title to “Maximum Value Ranges”
• Updated Table 24, “Typical Operating Current Consumption (MIPI),” on page 61
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7/12/12
• Updated Power consumption in Table 1, “Key Performance Parameters,” on page 1
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7/9/12
• Updated “Features” on page 1
• Updated Table 1, “Key Performance Parameters,” on page 1
• Updated Table 2, “Modes of Operation and Power Consumption at 100% FOV,” on
page 2
• Updated Figure 3: “Typical Application Circuit—MIPI Connection,” on page 8
• Added “System States” on page 11
• Updated Figure 5: “Recommended Power-up Sequence,” on page 13
• Updated Table 7: “Power-up Sequence,” on page 13
• Updated Figure 6: “Recommended Power-down Sequence,” on page 14
• Updated Figure 7: “Hard Standby and Hard Reset,” on page 15
• Updated Figure 15: “Clocking Configuration,” on page 26
• Added “Interlaced HDR Readout” on page 28
• Updated “Binning, Skipping, and Summing Mode” on page 42
• Added Table 14, “Available Skip, Bin, and Sum Modes in the AR0833 Sensor,” on
page 42
• Updated “Scaler” on page 43
• Updated Table 16, “Recommended Analog Gain Setting,” on page 53
• Updated “Internal VCM Driver” on page 54
• Added Table 24, “Typical Operating Current Consumption (MIPI),” on page 61
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/28/12
• Updated dynamic range in Table 1, “Key Performance Parameters,” on page 1
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/14/12
• Updated to Preliminary
• Updated headers
• Updated trademarks
• Updated “Features” on page 1
AR0833_DS Rev. H Pub. 4/15 EN
63
©Semiconductor Components Industries, LLC, 2015.