AR0833 Datasheet, PDF (38/64 Pages) ON Semiconductor – 8 Mp CMOS Digital Image Sensor

AR0833: 1/3.2-Inch 8 Mp CMOS Digital Image Sensor
Integration Time for Interlaced HDR Readout
Binning
The AR0833 supports 2 x 1 (column binning, also called x-binning). Binning has many of
the same characteristics as skipping, but because it gathers image data from all pixels in
the active window (rather than a subset of them), it achieves superior image quality and
avoids the aliasing artifacts that can be a characteristic side effect of skipping.
Binning is enabled by selecting the appropriate subsampling settings (in read_mode, the
sub-register x_odd_inc = 3 and y_odd_inc = 1 for x-binning and setting the appropriate
binning bit in read_mode R0x3040[11] = 1 for x_bin_enable). As with skipping, x_ad-
dr_end and y_addr_end may require adjustment when binning is enabled. It is the first
of the two columns/rows binned together that should be the end column/row in
binning, so the requirements to the end address are exactly the same as in skipping
mode. The effect of the different binning is shown in Figure 27 below and Figure 28 on
page 39.
Binning can also be enabled when the 4X subsampling mode is enabled (x_odd_inc = 7
and y_odd_inc = 1 for x-binning, x_odd_inc = 7 and y_odd_inc = 7 for 4X xy-binning). In
this mode, however, not all pixels will be used so this is not a 4X binning implementa-
tion. An implementation providing a combination of skip2 and bin2 is used to achieve
4X subsampling with better image quality. The effect of this subsampling mode is shown
in Figure 28 on page 39.
Figure 27: Bin2 Pixel Readout (x_odd_inc = 3, y_odd_inc = 1, x_bin = 1)
X incrementing
AR0833_DS Rev. H Pub. 4/15 EN
38
©Semiconductor Components Industries, LLC, 2015.