TDA8035HN Datasheet, PDF (5/32 Pages) NXP Semiconductors – Smart card interface externally by a resistor bridge

NXP Semiconductors
7. Pinning information
7.1 Pinning
TDA8035HN
Smart card interface
terminal 1
index area
I/OUC 1
PORADJ 2
CMDVCCN 3
VDD(INTF) 4
CLKDIV1 5
CLKDIV2 6
EN_5V/3VN 7
EN_1.8VN 8
TDA8035
24 CLK
23 RST
22 VCC
21 VUP
20 SAP
19 SBP
18 VDDP
17 SBM
Transparent top view
Fig 2. Pin configuration HVQFN32
001aan746
7.2 Pin description
Table 3. Pin description
Symbol
Pin
Supply
I/OUC
1
V_DD(INTF)
PORADJ
2
V_DD(INTF)
Type
I/O
I
CMDVCCN 3
V_DD(INTF)
4
CLKDIV1
5
CLKDIV2
6
EN_5V/3VN 7
V_DD(INTF)
V_DD(INTF)
V_DD(INTF)
V_DD(INTF)
V_DD(INTF)
I
supply
I
I
I
EN_1.8 VN 8
RSTIN
9
OFFN
10
V_DD(INTF) I
V_DD(INTF) I
V_DD(INTF) O
GND
11
XTAL1
12
XTAL2
13
VREG
14
SAM
15
-
V_DD(INTF)
V_DD(INTF)
V_DDP
V_DDP
supply
I
O
supply
I/O
GNDP
16
-
supply
Description
host data I/O line (internal 10k pullup resistor to V_DD(INTF) )
Input for V_DD(INTF) supervisor. PORADJ threshold can be changed
with an external R bridge
start activation sequence input from the host (active LOW)
interface supply voltage
control with CLKDIV2 for choosing CLK frequency see Table 4
control with CLKDIV1 for choosing CLK frequency see Table 4
control signal for selecting Vcc = 5 V (HIGH) or Vcc = 3 V (LOW) if
EN_1.8 VN = High
control signal for selecting Vcc = 1.8V (low)
card reset input from the host (active HIGH)
NMOS interrupt to the host (active LOW) with 10k internal pull up
resistor to V_DD(INTF) (See fault detection)
ground
crystal connection
crystal connection
Internal supply voltage
DC/DC converter capacitor ; connected between SAM and SAP; C =
330nF with ESR < 100mΩ
DC/DC converter power supply ground
TDA8035HN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
© NXP B.V. 2011. All rights reserved.
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