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| TDA8035HN Datasheet, PDF (25/32 Pages) NXP Semiconductors – Smart card interface externally by a resistor bridge | |||
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NXP Semiconductors
13. Package outline
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
D
BA
terminal 1
index area
E
A
A1
TDA8035HN
Smart card interface
SOT617-7
c
detail X
L
8
e
9
e1
1/2 e
b
16
v CAB
wC
17
e
Eh
e2
1/2 e
y1 C
C
y
1
24
terminal 1
32
25
X
index area
Dh
Dimensions
0
2.5
5 mm
scale
Unit
A A1 b
c D(1) Dh E(1) Eh e e1 e2 L
v
w
y y1
max 1.00 0.05 0.30
5.1 2.2 5.1 2.2
0.5
mm nom 0.85 0.02 0.21 0.2 5.0 2.1 5.0 2.1 0.5 3.5 3.5 0.4 0.1 0.05 0.05 0.1
min 0.80 0.00 0.18
4.9 2.0 4.9 2.0
0.3
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT617-7
---
---
Fig 14. Package outline SOT617-7
sot617-7_po
Issue date
10-02-08
10-02-09
TDA8035HN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 â 19 April 2011
© NXP B.V. 2011. All rights reserved.
25 of 32
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