TDA8035HN Datasheet, PDF (3/32 Pages) NXP Semiconductors – Smart card interface externally by a resistor bridge

NXP Semiconductors
TDA8035HN
Smart card interface
Table 1. Quick reference data …continued
V_DDP = 3.3 V; V_DD(INTF) = 3.3 V; f_Xtal = 10 MHz; GND = 0 V; T_amb = 25 °C; unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
V_CC
supply voltage
5 V card; DC I_CC < 65 mA
5 V card; AC current spikes
of 40 nAs
4.75 5.0
4.65 5.0
3 V card; DC I_CC < 65 mA
3 V card; AC current spikes
of 40 nAs
2.85 -
2.76 -
1.8 V card; DC I_CC < 35 mA
1.8 V card; AC current
spikes of 15 nAs
1.71 -
1.66 -
V_ripple(p-p)
peak-to-peak ripple voltage
from 20 kHz to 200 MHz
-
-
I_CC
supply current
V_CC = 5 V or 3 V
-
-
V_CC = 1.8 V
-
-
General
t_deact
P_tot
T_amb
deactivation time
total power dissipation
ambient temperature
total sequence
T_amb = −40 °C to +85 °C
35
90
-
-
-25
-
Max
5.25
5.25
3.15
3.24
1.89
1.94
300
65
35
250
0.45
+85
Unit
V
V
V
V
V
V
mV
mA
mA
μs
W
°C
5. Ordering information
Table 2. Ordering information
Type number
Package
Name
TDA8035HN/C1
HVQFN32
Description
plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 × 5 × 0.85
Version
SOT617-7
TDA8035HN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
© NXP B.V. 2011. All rights reserved.
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