TDA8035HN Datasheet, PDF (17/32 Pages) NXP Semiconductors – Smart card interface externally by a resistor bridge

NXP Semiconductors
TDA8035HN
Smart card interface
9. Limiting values
All card contacts are protected against any short with any other card contact.
Stress beyond these levels may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under this condition is not implied.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max Unit
V_DDP
V_DD(INTF)
V_IH
power supply voltage
interface supply voltage
High-level input voltage CS, PRESN,
CMDVCCN, CLKDIV2,
CLKDIV1, EN_1.8VN,
EN_5V/3VN, RSTIN,
OFFN, PORADJ, XTAL1,
I/OUC, AUX1UC, AUX2UC,
V_DDP, V_DD(INTF)
I/O, RST, AUX1, AUX2 and
CLK
−0.3 6
V
−0.3 4.1
V
−0.3 4.1
V
−0.3 5.75 V
T_amb
T_stg
T_j
P_tot
V_ESD
ambient temperature
storage temperature
junction temperature
total power dissipation
electrostatic discharge
voltage
T_amb = −40 to +85 °C
Human Body Model (HBM)
on card pins I/O, RST, V_CC,
AUX1, CLK, AUX2, PRESN
−25
+85
°C
−55
+150 °C
+125 °C
0.45 W
−10
+10
kV
within typical application
Human Body Model (HBM)
−2
+2
kV
on all other pins
Machine Model (MM) on
all pins
−200 +200 V
Field Charged Device
Model (FCDM) on all pins
−500 +500 V
10. Thermal characteristics
Table 6. Thermal characteristics
Symbol Package name Parameter
Conditions
Typ
Unit
R_th(j-a)
HVQFN32
thermal resistance from junction in free air with 4 thermal vias
55
K/W
to ambient
on pcb
in free air without thermal
vias on pcb
63
K/W
TDA8035HN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
© NXP B.V. 2011. All rights reserved.
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