TDA8035HN Datasheet, PDF (24/32 Pages) NXP Semiconductors – Smart card interface externally by a resistor bridge

NXP Semiconductors
12. Application information
TDA8035HN
Smart card interface
V_DD(INTF)
V_DD(INTF)
VDDI
R1(5)
R2(5) VDDI
C1
100 nF(1)
I/OUC
1
PORADJ ₂
CMDVCCN
3
VDD(INTF)
4
CLKDIV1
5
CLKDIV2 ₆
EN5V_3V
7
EN_1.8V
8
TDA8035
C8
220 nF(3)
CLK
24
23 ^RST
VCC
22
VUP ^C5
21
SAP ^{1 μF(2)}
20
19 ^SBP
VDDP
18
SBM ^C4
17
330 nF
CARD
CONNECTOR
C5
C1
C6
C2
C7
C3
C8
C4
R
0Ω
C9(4)
220 nF
VDDI
VDD
C6(2)
100 nF
C7(2)
10 μF
C10
56 pF
C2
100 nF(1)
C3
330 nF
(1) Place close to the protected pin with good (low resistive) and straight connection to the main ground.
(2) Place close to the supply pin with good (low resistive) and straight connection to GNDP.
(3) Place close to TDA8035´s VCC pin with good connection to GNDC.
(4) Place close to card connector´s C1 (VCC) pinwidth good connection to GNDC.
(5) Optional bridge. If not used, R1 must be O Ohm and R2 absent (direct connection to VDDI).
(6) GNDP and GNDC must be connected to the main ground with a straight and low resistive connection
Fig 13. Application diagram
001aan759
TDA8035HN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1.0 — 19 April 2011
© NXP B.V. 2011. All rights reserved.
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