TDA8023 Datasheet, PDF (3/32 Pages) NXP Semiconductors – Low power IC card interface

NXP Semiconductors
TDA8023
Low power IC card interface
Table 1. Quick reference data …continued
V_DD = 3.3 V; V_DD(INTF) = 1.5 V; f_CLKIN = 10 MHz; GND = 0 V; T_amb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
General
t_deact
P_tot
T_amb
deactivation time
total power dissipation
ambient temperature
total sequence
T_amb = −25 °C to +85 °C
60
80
-
-
−40 -
Max Unit
100 µs
500 mW
+85 °C
[1] Sum of currents on pins V_DD and V_DDI.
[2] Two ceramic multilayer capacitors of minimum 100 nF with low Equivalent Series Resistance (ESR) should be used in order to meet
these specifications.
[3] Output voltage towards the card, including ripple.
5. Ordering information
Table 2. Ordering information
Type number
Package
Name
Description
TDA8023TT
TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm
6. Block diagram
Version
SOT361-1
optional
external
resistor
bridge
100 nF
R2
PORADJ 20
1 µF
V_DD
22
R1
CDEL 21
SUPPLY
CCDEL
SUPERVISOR
GND 10
100 nF
100 nF
V_{DDP SBP SBM SAM SAP}
26 27 25 23 28
DC-TO-DC CONVERTER
24 GNDP
1 VUP
100 nF
4
V_DDI
3
SDWN
SDA ⁵
6
SCL
9
CLKIN
I²C-BUS
I/OUC ^{11 INTERFACE}
INT ²
8
SPRES
7
SAD0
TDA8023
SEQUENCER
CLOCK
COUNTER
CARD
DRIVERS
17
V_CC
100 nF
18
RST
16
CLK
14 _I/O
13
C4
12
C8
19
PRES
15 _GNDC
Fig 1. Block diagram with capacitive DC-to-DC converter
001aag336
TDA8023_1
Product data sheet
Rev. 01 — 16 July 2007
© NXP B.V. 2007. All rights reserved.
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