TDA8023 Datasheet, PDF (29/32 Pages) NXP Semiconductors – Low power IC card interface

NXP Semiconductors
TDA8023
Low power IC card interface
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
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MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TDA8023_1
Product data sheet
Rev. 01 — 16 July 2007
© NXP B.V. 2007. All rights reserved.
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