TDA8023 Datasheet, PDF (16/32 Pages) NXP Semiconductors – Low power IC card interface

NXP Semiconductors
TDA8023
Low power IC card interface
In case of overcurrent on pin V_CC, removal of the card during a session, overheating,
supply dropout, DC-to-DC out of limits, or overcurrent on pin RST, the TDA8023 performs
an automatic emergency deactivation sequence on the card, resets bit START and pulls
pin INT LOW.
9. Limiting values
Table 13. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
V_DD
V_DD(DCDC)
supply voltage
DC-to-DC converter
supply voltage
on pin V_DD
on pin V_DDP
V_DD(INTF)
V_IH
interface supply voltage on pin V_DDI
HIGH-level input voltage on pins SAP, SAM, SBP, SBM, VUP
on pins SDA, SCL
on all other pins
P_tot
total power dissipation T_amb = −25 °C to +85 °C
T_stg
storage temperature
T_j
junction temperature
V_esd
electrostatic discharge Human Body Model (HBM)
voltage
on card pins I/O, V_CC, CLK, GNDC, PRES, RST
on all other pins
Machine Model (MM)
all pins, excluding card pins
Min
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
−55
-
[1]
−6
−2
−200
Max
Unit
+6.5
V
+6.5
V
+6.5
V
+7.5
V
+6.5
V
V_DD + 0.5 V
500
mW
+150
°C
150
°C
+6
kV
+2
kV
+200
V
[1] Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM;
1500 Ω; 100 pF) defines 3 pulses positive and 3 pulses negative on each pin referenced to ground.
10. Thermal characteristics
Table 14.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Conditions
in free air
Typ Unit
100 K/W
TDA8023_1
Product data sheet
Rev. 01 — 16 July 2007
© NXP B.V. 2007. All rights reserved.
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