TDA8023 Datasheet, PDF (26/32 Pages) NXP Semiconductors – Low power IC card interface

NXP Semiconductors
TDA8023
Low power IC card interface
13. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
y
Z
28
pin 1 index
1
e
E
A
X
c
H_E
vM A
15
14
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT361-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.8
0.5
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT361-1 (TSSOP28)
TDA8023_1
Product data sheet
Rev. 01 — 16 July 2007
© NXP B.V. 2007. All rights reserved.
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