UPD784020 Datasheet, PDF (82/90 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCOMPUTER

mPD784020, 784021
H 16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the mPD784021.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1 Soldering Conditions for Surface-Mount Devices
(1) mPD784020GC-3B9 : 80-pin plastic QFP (14 ¥ 14 mm)
mPD784021GC-3B9 : 80-pin plastic QFP (14 ¥ 14 mm)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 ½C
Reflow time: 30 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 ½C
Reflow time: 40 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 3
Solder temperature: 260 ½C or less
Flow time: 10 seconds or less
Number of flow process: 1
Preheating temperature: 120 ½C max. (measured on the package
surface)
Terminal temperature: 300 ½C or less
Flow time: 3 seconds or less (for each side of device)
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
(2) mPD784021GK-BE9: 80-pin plastic TQFP (fine pitch) (12 ¥ 12 mm)
Soldering process
Infrared ray reflow
VPS
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 ½C
Reflow time: 30 seconds or less (at 210 ½C or more)
Maximum allowable number of reflow processes: 2
Exposure limit^Note: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Peak package’s surface temperature: 215 ½C
Reflow time: 40 seconds or less (at 200 ½C or more)
Maximum allowable number of reflow processes: 2
Exposure limit^Note: 7 days (10 hours of pre-baking is required at
125 ½C afterward.)
<Cautions>
Non-heat resistant trays, such as magazine and taping trays, cannot
be baked before unpacking.
Terminal temperature: 300 ½C or less
Flow time: 3 seconds or less (for each side of device)
Symbol
IR35-107-2
VP15-107-2
–
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ½C and maximum relative humidity at 65 % or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
82