MC68HC705C8A Datasheet, PDF (193/222 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Mechanical Specifications
44-Lead Ceramic-Leaded Chip Carrier (CLCC)
14.6 44-Lead Ceramic-Leaded Chip Carrier (CLCC)
-N-
-L-
Y BRK
D
B 0.18 (0.007) ^M T N ^S -P ^S L ^S
U ^{0.18 (0.007) M T N S -P S L S}
44
1
-P-
V
W
D
DETAIL D-D
S
0.20 (0.008) M T L M N M -P M
A 0.18 (0.007) ^M T L ^S N ^S -P ^S
R 0.18 (0.007) M T L S N S -P S
C
G
G1
E
J
DETAIL S
0.10 (0.004)
-T- SEATING
PLANE
0.25 (0.010) S T L S N S -P S
0.18 (0.007) M T L S N S -P S
H
0.18 (0.007) M T N S -P S L S
K1
K
F
DETAIL S
0.18 (0.007) M T L S N S -P S
0.18 (0.007) M T N S -P S L S
G1
0.25 (0.010) M T N S -P S L S
NOTES:
1. DATUMS -L-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT
BODY.
2. DIMINSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING
PLANE.
3. DIMINSIONS R AND U DO NOT INCLUDE
GLASS MENISCUS. ALLOWABLE GLASS
RUNOUT IS 0.25 (0.010) PER SIDE.
4. DIMINSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
MILLIMETERS
DIM MIN MAX
A 17.40 17.65
B 17.40 17.65
C 4.20 4.57
E 2.29 2.79
F 0.33 0.48
G 1.27 BSC
H 0.66 0.81
J 0.51 ---
K 0.64 ---
R 16.51 16.66
S 6.94 7.26
U 16.51 16.66
V 1.07 1.21
W 1.07 1.21
Y
--- 0.50
G1 14.99 16.00
K1 1.02 ---
INCHES
MIN MAX
0.685 0.695
0.685 0.695
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020 ---
0.025 ---
0.650 0.656
0.273 0.286
0.650 0.656
0.042 0.048
0.042 0.048
--- 0.020
0.590 0.630
0.040
---
Figure 14-4. MC68HC705C8AFS Package Dimensions (Case #777B)
MC68HC705C8A — Rev. 2.0
MOTOROLA
Mechanical Specifications
Technical Data
193