PIC16F631_08 Datasheet, PDF (241/306 Pages) Microchip Technology – 20-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F631/677/685/687/689/690
17.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
2:
3:
Sym.
Characteristic
Typ.
Units
Conditions
θJA
Thermal Resistance
Junction to Ambient
62.4
C/W 20-pin PDIP package
85.2
C/W 20-pin SOIC package
108.1 C/W 20-pin SSOP package
40
C/W 20-pin QFN 4x4mm package
θJC
Thermal Resistance
Junction to Case
28.1
C/W 20-pin PDIP package
24.2
C/W 20-pin SOIC package
32.2
C/W 20-pin SSOP package
2.5
C/W 20-pin QFN 4x4mm package
TDIE
Die Temperature
150
C For derated power calculations
PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
—
W PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
—
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
PDER
Derated Power
—
W PDER = PDMAX (TDIE - TA)/θJA
(NOTE 2, 3)
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
© 2008 Microchip Technology Inc.
DS41262E-page 239