PIC17C4X Datasheet, PDF (177/240 Pages) Microchip Technology – High-Performance 8-Bit CMOS EPROM/ROM Microcontroller

PIC17C4X
Applicable Devices 42 R42 42A 43 R43 44
19.1 DC CHARACTERISTICS:
PIC17CR42/42A/43/R43/44-16 (Commercial, Industrial)
PIC17CR42/42A/43/R43/44-25 (Commercial, Industrial)
PIC17CR42/42A/43/R43/44-33 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Parameter
No.
Sym
Characteristic
Min Typ† Max Units
Conditions
D001
VDD Supply Voltage
4.5
– 6.0
V
D002
VDR RAM Data Retention 1.5 * –
–
Voltage (Note 1)
V Device in SLEEP mode
D003
VPOR VDD start voltage to
–
ensure internal
Power-on Reset signal
VSS –
V See section on Power-on Reset for
details
D004
SVDD VDD rise rate to
0.060 * –
ensure internal
Power-on Reset signal
– mV/ms See section on Power-on Reset for
details
D010
D011
D012
D013
D015
D014
IDD Supply Current
(Note 2)
–
3
6
mA FOSC = 4 MHz (Note 4)
–
6 12 * mA FOSC = 8 MHz
–
11 24 * mA FOSC = 16 MHz
–
19 38 mA FOSC = 25 MHz
–
25 50 mA FOSC = 33 MHz
–
95 150 µA FOSC = 32 kHz,
WDT enabled (EC osc configuration)
D020
D021
IPD Power-down
Current (Note 3)
–
10 40 µA VDD = 5.5V, WDT enabled
–
<1 5
µA VDD = 5.5V, WDT disabled
*
These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD,
MCLR = VDD; WDT enabled/disabled as specified.
Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-
sidered.
For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: VDD / (2 • R).
For capacitive loads, the current can be estimated (for an individual I/O pin) as (CL • VDD) • f
CL = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.
The capacitive currents are most significant when the device is configured for external execution (includes
extended microcontroller mode).
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.
© 1996 Microchip Technology Inc.
DS30412C-page 177