MAX11270 Datasheet, PDF (6/46 Pages) Maxim Integrated Products – Integrated PGA

MAX11270
24-Bit, 10mW, 130dB SNR, 64ksps Delta-Sigma
ADC with Integrated PGA
Absolute Maximum Ratings
AVDD to AVSS......................................................-0.3V to +3.9V
DVDD to DGND.....................................................-0.3V to +3.9V
DVDD to AVSS......................................................-0.3V to +3.9V
AVSS to DGND...................................................-1.95V to +0.3V
Analog Inputs
(AINP, AINM, REFP, REFN, CAPP, CAPN)
to AVSS............ -0.3V to the lower of 3.9V or (V_AVDD + 0.3V)
Digital Inputs to DGND
(RSTB, SYNC, DIN, SCLK, CLK,
GPIO1-3).......... -0.3V to the lower of 3.9V or (V_DVDD + 0.3V)
Digital Outputs to DGND
(RDYB, DOUT,
GPIO1-3).......... -0.3V to the lower of 3.9V or (V_DVDD + 0.3V)
Digital Inputs to AVSS
(RSTB, SYNC, DIN, SCLK, CLK,
GPIO1–GPIO3).................................................-0.3V to +3.9V
Digital Outputs to AVSS
(RDYB, DOUT, GPIO1–3).....................................-0.3V to +3.9V
CAPREG to DGND................................................-0.3V to +2.2V
CAPREG to AVSS.................................................-0.3V to +3.9V
Continuous Power Dissipation (Single-Layer Board)
TSSOP (derate 13.9mW/°C above +70°C)........... 1111.10mW
Operating Temperature Range............................ -40°C to +85°C
Storage Temperature Range............................. -55°C to +150°C
Junction Temperature (continuous).................................. +150°C
Lead temperature (soldering, 10s)................................... +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TSSOP
Junction-to-Case Thermal Resistance (θ_JC)................13°C/W
Junction-to-Ambient Thermal Resistance (θ_JA)...........72°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V_AVDD = 3.6V, V_AVSS = 0V, V_DVDD = 2.0V, V_REFP = 2.5V, V_REFN = 0V; f_DATA = 1000sps, External Clock = 8.192MHz; Continuous
conversion mode (SCYCLE = 0); PGA maximum output is 300mV below AVDD and minimum output is 300mV above AVSS,
T_A = T_MIN to T_MAX, unless otherwise noted. Typical values are at T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
STATIC PERFORMANCE
Noise-Free Resolution
(Note 3)
NFR
1.9sps data rate (Bypass Mode only)
1ksps data rate (Bypass Mode only)
NOISE REFERRED TO INPUT V_N (See Tables 1–4)
Integral Nonlinearity
Bypass, Buffer, PGA = 1, 2
INL
PGA > 2
Offset Error
Offset Drift
Gain Error
Gain Drift
DC Common-Mode
Rejection (Note 4)
V_OS After system offset calibration
V_{OS_DRIFT}
G_ERR After system gain calibration
G_{ERR_DRIFT}
CMR_DC
Bypass and Buffer mode
PGA Gain = 4
AVDD, AVSS DC Supply
Rejection Ratio
Bypass and Buffer mode
PSRRA
PGA Gain = 4
DVDD DC Supply Rejection
Ratio
Bypass and Buffer mode
PSRRD
PGA Gain = 4
MIN
19.2
16.9
120
100
80
80
95
95
TYP
MAX UNITS
20.4
Bits
17.4
1
2
10
50
2
0.05
135
120
105
100
120
120
4
ppm
nV
nV/°C
ppm
ppm/°C
dB
dB
dB
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