LTC3811_15 Datasheet, PDF (46/48 Pages) Linear Technology – High Speed Dual, Multiphase Step-Down DC/DC Controller

LTC3811
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
0.70 ± 0.05
5.50 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
3.15 ± 0.05
(2 SIDES)
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.25 ± 0.05
0.50 BSC
5.15 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
0.75 ± 0.05
0.00 – 0.05
PACKAGE
OUTLINE
3.15 ± 0.10
(2 SIDES)
37 38
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
0.40 ±0.10
1
2
7.00 ± 0.10
(2 SIDES)
5.15 ± 0.10
(2 SIDES)
0.75 ± 0.05
0.200 REF
0.00 – 0.05
0.200 REF 0.25 ± 0.05
0.50 BSC
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
0.40 ± 0.10
(UH) QFN 0205
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3811f
46