82562EZ Datasheet, PDF (37/40 Pages) Intel Corporation – 82562EZ 10/100 Mbps Platform LAN Connect (PLC)

Networking Silicon — 82562EZ
8.0
Package and Pinout Information
8.1
Package Information
The 82562EZ is a 196 Ball Grid Array (BGA) package. The package dimensions are shown in
Figure 5. More information on Intel device packaging is available in the Intel Packaging
Handbook, which is available from the Intel Developer website..
Figure 5. Dimension Diagram for the 196-pin BGA
1.56 +/-0.19
0.85
30 ^o
0.32 +/-0.04
0.40 +/-0.10
Seating Plate
Note: All dimensions are in millimeters.
Substrate change from
0.36 mm to 0.32 mm
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Datasheet
31