80960JD Datasheet, PDF (25/61 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

A
80960JD
Table 11. 132-Lead PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
0
(0)
θ_JC (Junction-to-Case)
6
θ_CA (Case-to-Ambient -No Heatsink)
23
50
(0.25)
7
20
Airflow — ft./min (m/sec)
100
(0.50)
200
(1.01)
400
(2.03)
7
7
7
18
14
10
600
(3.04)
7
9
800
(4.06)
7
8
θ_JA
θ_CA
θ_JC
θ_JB
θ_JL
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2. θ_JA = θ_JC + θ_CA
3. θ_JL = 18°C/W (approx.)
4. θ_JB = 18°C/W (approx.)
65
60
55
50
45
40
35
30
0
100
PGA with no heatsink
200
300
400
500
AIRFLOW (ft/min)
PGA with omnidirectional heatsink
600
700
800
PGA with unidirectional heatsink
Figure 6. 50 MHz Maximum Allowable Ambient Temperature
PRELIMINARY
21