80960JD Datasheet, PDF (24/61 Pages) Intel Corporation – EMBEDDED 32-BIT MICROPROCESSOR

80960JD
A
3.2 Package Thermal Specifications
The 80960JD is specified for operation when T_C
(case temperature) is within the range of 0°C to 85°C
for the (PGA) 80960JD-50, or 0°C to 100°C for the
(PQFP and PGA) 80960JD-40 and 80960JD-33.
Case temperature may be measured in any
environment to determine whether the 80960JD is
within specified operating range. The case temper-
ature should be measured at the center of the top
surface, opposite the pins.
θ_CA is the thermal resistance from case to ambient.
Use the following equation to calculate T_A, the
maximum ambient temperature to conform to a
particular case temperature:
T_A = T_C - P (θ_CA)
Junction temperature (T_J) is commonly used in
reliability calculations. T_J can be calculated from θ_JC
(thermal resistance from junction to case) using the
following equation:
T_J = T_C + P (θ_JC)
Similarly, if T_A is known, the corresponding case
temperature (T_C) can be calculated as follows:
T_C = T_A + P (θ_CA)
Compute P by multiplying I_CC from Table 14 and
V_CC. Values for θ_JC and θ_CA are given in Table 10 for
the PGA package and Table 11 for the PQFP
package. For high speed operation, the processor’s
θ_JA may be significantly reduced by adding a
heatsink and/or by increasing airflow.
Figure 6 shows the maximum ambient temperature
(T_A) permitted without exceeding T_C for the
80960JD-50 in a PGA package. Figure 7 illustrates
this for the 80960JD-40 in PGA and PQFP
packages. The curves are based on minimum I_CC
(hot) and maximum V_CC of +5.25 V, with a T_CASE of
+85°C for the 80960JD-50, or a T_CASE of +100°C for
the 80960JD-40.
Table 10. 132-Lead PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
200 400 600 800
(0) (1.01) (2.03) (3.04) (4.06)
θ_JC (Junction-to-Case)
θ_CA (Case-to-Ambient) (No Heatsink)
θ_CA (Case-to-Ambient) (Omnidirectional Heatsink)
θ_CA (Case-to-Ambient) (Unidirectional Heatsink)
3
3
3
3
3
18
15
12
11
11
15
12
9
8
8
14
11
8
7
7
1000
(5.08)
3
11
8
7
θ_JA
θ_CA
θ_J-PIN
θ_JC
θ_J-CAP
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2. θ_JA = θ_JC + θ_CA
3. θ_J-CAP = 4°C/W (approx.)
4. θ_J-PIN = 4°C/W (inner pins) (approx.)
5. θ_J-PIN = 8°C/W (outer pins) (approx.)
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PRELIMINARY