80960CA-25 Datasheet, PDF (20/62 Pages) Intel Corporation – SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR

SPECIAL ENVIRONMENT 80960CA-25 -16
Table 9 80960CA PGA Package Thermal Characteristics
Thermal Resistance C Watt
Parameter
Airflow ft min (m sec)
0
200
400
600
800
(0) (1 01) (2 03) (3 07) (4 06)
i Junction-to-Case
(Case measured as 1 5 1 5
15
15
15
shown in Figure 4)
i Case-to-Ambient
(No Heatsink)
17
14
11
9
71
i Case-to-Ambient
(With Heatsink)
13
9
55
5
39
1000
(5 07)
15
66
34
NOTES
1 This table applies to 80960CA PGA plugged into socket or soldered directly to board
2 i_JA e i_JC a i_CA
0 285 high unidirectional heatsink (Al alloy 6061 50 mil fin width 150 mil center-to-center fin spacing)
20