 English |
|
|
|
|
|
|
|
| TC1197 Datasheet, PDF (179/183 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller | |||
| |||
| ◁ |
5.4
Package and Reliability
TC1197
Electrical Parameters
5.4.1 Package Parameters
Table 31 Thermal Characteristics of the Package
Device
Package
RÎJCT1) RÎJCB1) Unit
Note
TC1197 PG-BGA-416-10 4
6
K/W
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA Ã PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
RTJA can be obtained from the upper four partial thermal resistances.
Data Sheet
175
V1.1, 2009-05
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese