TC1167 Datasheet, PDF (123/127 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller

5.4
Package and Reliability
5.4.1 Package Parameters
TC1167
Electrical Parameters
Table 25 Thermal Parameters (Operating Conditions apply)
Device Package
TC1167 PG-LQFP-176-5
R_ΘJCT1)
6.5
R_ΘJCB1)
5.5
R_ΘJLeads1) Unit
23
K/W
Note
1) The top and bottom thermal resistances between the case and the ambient (R_TCAT, R_TCAB) are to be combined
with the thermal resistances between the junction and the case given above (R_TJCT, R_TJCB), in order to calculate
the total thermal resistance between the junction and the ambient (R_TJA). The thermal resistances between the
case and the ambient (R_TCAT, R_TCAB) depend on the external system (PCB, case) characteristics, and are
under user responsibility.
The junction temperature can be calculated using the following equation: T_J = T_A + R_TJA × P_D, where the R_TJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R_TJA can be obtained from the upper four partial thermal resistances.
Thermal resistances as measured by the ‘cold plate method’ (MIL SPEC-883 Method 1012.1).
Data Sheet
118
V1.3, 2009-10