7133LA70GB Datasheet, PDF (2/16 Pages) Integrated Device Technology – HIGH SPEED 2K X 16 DUAL-PORT SRAM

IDT7133SA/LA, IDT7143SA/LA
High-Speed 2K x 16 Dual-Port RAM
Military, Industrial and Commercial Temperature Ranges
RAM or as a “MASTER” Dual-Port RAM together with the IDT7143
“SLAVE” Dual-Port in 32-bit-or-more word width systems. Using the IDT
MASTER/SLAVE Dual-Port RAM approach in 32-bit-or-wider memory
system applications results in full-speed, error-free operation without the
need for additional discrete logic.
Both devices provide two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. An automatic power
down feature, controlled by CE, permits the on-chip circuitry of each
Pin Configurations^(1,2,3)
port to enter a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technology, these
devices typically operate on only 1,150mW of power. Low-power (LA)
versions offer battery backup data retention capability, with each port
typically consuming 200µW for a 2V battery.
The IDT7133/7143 devices have identical pinouts. Each is packed
in a 68-pin ceramic PGA, 68-pin flatpack, 68-pin PLCC and 100-pin
TQFP. Military grade product is manufactured in compliance with the
latest revision of MIL-PRF-38535 QML, making it ideally suited to
military temperature applications demanding the highest level of
performance and reliability.
INDEX
I/O9L
I/O10L
I/O11L
I/O12L
I/O13L
I/O14L
I/O15L
VCC⁽¹⁾
GND⁽²⁾
I/O0R
I/O1R
I/O2R
I/O3R
I/O4R
I/O5R
I/O6R
I/O7R
9 8 7 6 5 4 3 2 68 67 66 65 64 63 62 61
10
60
1
11
59
12
58
13
57
14
56
15
55
16
IDT7133/43
54
17
J68-1 / F68-1⁽⁴⁾
53
18
68-Pin PLCC/Flatpack
52
19
Top View⁽⁵⁾
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
A6L
A5L
A4L
A3L
A2L
A1L
A0L
BUSYL
CEL
CER
BUSYR
A0R
A1R
A2R
A3R
A4R
A5R
,
2746 drw 02
Index
NOTES:
1. Both VCC pins must be connected to the power supply to ensure reliable
operation.
2. Both GND pins must be connected to the ground supply to ensure reliable
operation.
3. J68-Package body is approximately 0.95 in x 0.95 in x 0.17 in.
F68-Package body is approximately 1.18 in x 1.18 in x 0.16 in.
PN100-Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
N/C
N/C
N/C
N/C
I/O10L
I/O11L
I/O12L
I/O13L
GND
I/O14L
I/O15L
VCC
GND
I/O0R
I/O1R
I/O2R
VCC
I/O3R
I/O4R
I/O5R
I/O6R
N/C
N/C
N/C
N/C
1 ^{100 99}
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
2
74
N/C
N/C
3
73 N/C
4
72 N/C
5
71 A5L
6
70 A4L
7
69 A3L
8
68 A2L
9
67 A1L
10
IDT7133/43PF
66 A0L
11
PN100-1⁽⁴⁾
65 N/C
12
64 BUSYL
13
100-Pin TQFP
63 ^GND
14
Top View⁽⁵⁾
62 N/C
15
61 BUSYR
16
60 N/C
17
59 A0R
18
58 A1R
19
57 A2R
20
56 A3R
21
55 A4R
22
54 N/C
23
53 N/C
24
52 N/C
25
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
N/C
,
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6.242