FXLS8471Q Datasheet, PDF (68/75 Pages) Freescale Semiconductor, Inc – Linear Accelerometer

Package Footprint
0⁰.^.4⁵6⁶7⁷m^mm^mx^x0⁰.2^.25⁵m^mm^m
Package
footprint
PCB Land Pattern & Stencil
Solder mask opening
= PCB land pad edge
+ 0.113mm larger all
around
PCB land pad =
0.8mm x 0.3mm
No copper in this area
Stencil opening = PCB land
pad -0.015mm smaller all
around
= 0.77mm x 0.27mm
Figure 18. Recommended PCB land pattern, solder mask, and stencil opening near package footprint
Figure 19. Detailed dimensions
FXLS8471Q
68
Sensors
Freescale Semiconductor, Inc.