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S9S08SL8F1CTJ Datasheet, PDF (350/356 Pages) Freescale Semiconductor, Inc – provides the functional version of the on-chip modules
Appendix A Electrical Characteristics
SS
(INPUT)
1
3
SCK
(CPOL = 0)
(INPUT)
2
5
4
SCK
(CPOL = 1)
(INPUT)
MISO
(OUTPUT)
MOSI
(INPUT)
5
4
SEE
NOTE
10
SLAVE
MSB OUT
8
6
7
MSB IN
11
BIT 6 . . . 1
BIT 6 . . . 1
9
SLAVE LSB OUT
LSB IN
NOTE:
1. Not defined but normally LSB of character just received
Figure A-17. SPI Slave Timing (CPHA = 1)
A.13 Flash and EEPROM Specifications
This section provides details about program/erase times and program-erase endurance for the Flash and
EEPROM memory.
Program and erase operations do not require any special power sources other than the normal VDD supply.
For more detailed information about program/erase operations, see the Memory section.
Table A-16. Flash Characteristics
Num
1
2
3
4
5
6
7
8
9
C
Characteristic
Symbol
— Supply voltage for program/erase
Vprog/erase
— Supply voltage for read operation
— Internal FCLK frequency1
VRead
fFCLK
— Internal FCLK period (1/fFCLK)
— Byte program time (random location)2
— Byte program time (burst mode)2
— Page erase time2
— Mass erase time2
Program/erase endurance3
C
TL to TH = –40°C to +125°C
T = 25°C
tFcyc
tprog
tBurst
tPage
tMass
nFLPE
Min
2.7
2.7
150
5
10,000
Typical
9
4
4000
20,000
—
100,000
Max
5.5
5.5
200
6.67
—
—
Unit
V
V
kHz
μs
tFcyc
tFcyc
tFcyc
tFcyc
cycles
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
352
Freescale Semiconductor