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K20P48M50SF0 Datasheet, PDF (31/60 Pages) Freescale Semiconductor, Inc – K20 Sub-Family
Peripheral operating requirements and behaviors
6.4.1.2 Flash timing specifications — commands
Table 19. Flash command timing specifications
Symbol Description
Read 1s Block execution time
trd1blk32k
trd1blk128k
• 32 KB data flash
• 128 KB program flash
Min.
—
—
Typ.
—
—
Max.
0.5
1.7
trd1sec1k Read 1s Section execution time (flash sector)
—
tpgmchk Program Check execution time
—
trdrsrc Read Resource execution time
—
tpgm4 Program Longword execution time
—
Erase Flash Block execution time
tersblk32k
• 32 KB data flash
—
tersblk128k
• 128 KB program flash
—
—
60
—
45
—
30
65
145
55
465
61
495
tersscr Erase Flash Sector execution time
Program Section execution time
tpgmsec512
tpgmsec1k
• 512 B flash
• 1 KB flash
—
14
114
—
4.7
—
—
9.3
—
trd1all Read 1s All Blocks execution time
—
trdonce Read Once execution time
—
tpgmonce Program Once execution time
—
tersall Erase All Blocks execution time
—
tvfykey Verify Backdoor Access Key execution time
—
Program Partition for EEPROM execution time
tpgmpart32k
• 32 KB FlexNVM
—
—
1.8
—
25
65
—
115
1000
—
30
70
—
Set FlexRAM Function execution time:
tsetramff
tsetram8k
tsetram32k
• Control Code 0xFF
• 8 KB EEPROM backup
• 32 KB EEPROM backup
—
50
—
0.3
—
0.7
Byte-write to FlexRAM for EEPROM operation
teewr8bers Byte-write to erased FlexRAM location execution
—
175
time
Byte-write to FlexRAM execution time:
teewr8b8k
teewr8b16k
teewr8b32k
• 8 KB EEPROM backup
• 16 KB EEPROM backup
• 32 KB EEPROM backup
—
340
—
385
—
475
—
0.5
1.0
260
1700
1800
2000
Table continues on the next page...
Unit
ms
ms
μs
μs
μs
μs
ms
ms
ms
ms
ms
ms
μs
μs
ms
μs
ms
μs
ms
ms
μs
μs
μs
μs
Notes
1
1
1
2
2
1
2
1
3
K20 Sub-Family Data Sheet, Rev. 4 5/2012.
Freescale Semiconductor, Inc.
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