MC9S08AW60 Datasheet, PDF (305/320 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering numbers for MC9S08AW60/48/32/16 devices. See below for an example
of the device numbering system.
Table B-1. Device Numbering System
Device Number¹
Memory
FLASH
RAM
Available Packages²
Type
MC9S08AW60
MC9S08AW48
MC9S08AW32
MC9S08AW16
63,280
49,152
32,768
16,384
2048
1024
64-pin LQFP
64-pin QFP
48-pin QFN
44-pin LQFP
1 _{See Table 1-1 for a complete description of modules included on each device.}
2 _{See Table B-2 for package information.}
B.2 Orderable Part Numbering System
Status
(MC = Fully Qualified)
Memory
(9 = FLASH-based)
Core
Family
MC 9 S08 AW 60 C XX E
Pb free indicator
Package designator (See Table B-2)
Temperature range
(C = –40°C to 85°C)
(M = –40°C to 125°C)
Memory size designator
B.3 Mechanical Drawings
This following pages contain mechanical specifications for MC9S08AW60/48/32/16 package options. See
Table B-2 for the document numbers that correspond to each package type.
Table B-2. Package Information
Pin Count
44
48
64
64
Type
LQFP
QFN
LQFP
QFP
Designator
FG
FD
PU
FU
Document No.
98ASS23225W
98ARH99048A
98ASS23234W
98ASB42844B
MC9S08AW60 Data Sheet, Rev.1.0
Freescale Semiconductor
305