K30P121M100SF2V2 Datasheet, PDF (30/67 Pages) Freescale Semiconductor, Inc – K30 Sub-Family

Peripheral operating requirements and behaviors
1. When a crystal is being used with the 32 kHz oscillator, the EXTAL32 and XTAL32 pins should only be connected to
required oscillator components and must not be connected to any other devices.
6.3.3.2 32kHz oscillator frequency specifications
Table 19. 32kHz oscillator frequency specifications
Symbol Description
f_{osc_lo} Oscillator crystal
t_start Crystal start-up time
f_{ec_extal32} Externally provided input clock frequency
v_{ec_extal32} Externally provided input clock amplitude
Min.
Typ.
Max.
Unit
—
32.768
—
kHz
—
1000
—
ms
—
32.768
—
kHz
700
—
V_BAT
mV
Notes
1
2
2, 3
1. Proper PC board layout procedures must be followed to achieve specifications.
2. This specification is for an externally supplied clock driven to EXTAL32 and does not apply to any other clock input. The
oscillator remains enabled and XTAL32 must be left unconnected.
3. The parameter specified is a peak-to-peak value and V_IH and V_IL specifications do not apply. The voltage of the applied
clock must be within the range of V_SS to V_BAT.
6.4 Memories and memory interfaces
6.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 20. NVM program/erase timing specifications
Symbol Description
t_hvpgm4 Longword Program high-voltage time
t_hversscr Sector Erase high-voltage time
t_hversblk256k Erase Block high-voltage time for 256 KB
Min.
—
—
—
Typ.
7.5
13
104
Max.
18
113
904
Unit
Notes
μs
ms
1
ms
1
1. Maximum time based on expectations at cycling end-of-life.
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
30
Preliminary
Freescale Semiconductor, Inc.
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