K30P121M100SF2V2 Datasheet, PDF (2/67 Pages) Freescale Semiconductor, Inc – K30 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.4.1 Thermal operating requirements...........................20
1.1 Determining valid orderable parts......................................3
5.4.2 Thermal attributes.................................................20
2 Part identification......................................................................3
6 Peripheral operating requirements and behaviors....................21
2.1 Description.........................................................................3
6.1 Core modules....................................................................21
2.2 Format...............................................................................3
6.1.1 Debug trace timing specifications.........................21
2.3 Fields.................................................................................3
6.1.2 JTAG electricals....................................................22
2.4 Example............................................................................4
6.2 System modules................................................................25
3 Terminology and guidelines......................................................4
6.3 Clock modules...................................................................25
3.1 Definition: Operating requirement......................................4
6.3.1 MCG specifications...............................................25
3.2 Definition: Operating behavior...........................................5
6.3.2 Oscillator electrical specifications.........................27
3.3 Definition: Attribute............................................................5
6.3.3 32 kHz Oscillator Electrical Characteristics...........29
3.4 Definition: Rating...............................................................6
6.4 Memories and memory interfaces.....................................30
3.5 Result of exceeding a rating..............................................6
6.4.1 Flash electrical specifications................................30
3.6 Relationship between ratings and operating
6.4.2 EzPort Switching Specifications............................32
requirements......................................................................6
6.5 Security and integrity modules..........................................33
3.7 Guidelines for ratings and operating requirements............7
6.6 Analog...............................................................................33
3.8 Definition: Typical value.....................................................7
6.6.1 ADC electrical specifications.................................33
3.9 Typical value conditions....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........40
4 Ratings......................................................................................9
6.6.3 12-bit DAC electrical characteristics.....................43
4.1 Thermal handling ratings...................................................9
6.6.4 Voltage reference electrical specifications............46
4.2 Moisture handling ratings..................................................9
6.7 Timers................................................................................47
4.3 ESD handling ratings.........................................................9
6.8 Communication interfaces.................................................47
4.4 Voltage and current operating ratings...............................9
6.8.1 CAN switching specifications................................47
5 General.....................................................................................10
6.8.2 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................10
range)....................................................................48
5.2 Nonswitching electrical specifications...............................10
6.8.3 DSPI switching specifications (full voltage range).49
5.2.1 Voltage and current operating requirements.........10
6.8.4 I2C switching specifications..................................51
5.2.2 LVD and POR operating requirements.................11
6.8.5 UART switching specifications..............................51
5.2.3 Voltage and current operating behaviors..............12
6.8.6 SDHC specifications.............................................51
5.2.4 Power mode transition operating behaviors..........13
6.8.7 I2S/SAI Switching Specifications..........................52
5.2.5 Power consumption operating behaviors..............14
6.9 Human-machine interfaces (HMI)......................................58
5.2.6 EMC radiated emissions operating behaviors.......17
6.9.1 TSI electrical specifications...................................58
5.2.7 Designing with radiated emissions in mind...........18
6.9.2 LCD electrical characteristics................................59
5.2.8 Capacitance attributes..........................................18
7 Dimensions...............................................................................60
5.3 Switching specifications.....................................................18
7.1 Obtaining package dimensions.........................................61
5.3.1 Device clock specifications...................................18
8 Pinout........................................................................................61
5.3.2 General switching specifications...........................19
8.1 K30 Signal Multiplexing and Pin Assignments..................61
5.4 Thermal specifications.......................................................20
8.2 K30 Pinouts.......................................................................66
K30 Sub-Family Data Sheet, Rev. 1, 6/2012.
2
Preliminary
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