MC68HC705C8A_13 Datasheet, PDF (194/222 Pages) Freescale Semiconductor, Inc – Technical Data

Freescale Semiconductor, Inc.
Mechanical Specifications
14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC)
-N-
D
Y BRK
B
0.007(0.180) ^M T L-M ^S N ^S
U
0.007(0.180) M T L-M S N S
Z
-L-
-M-
V
44
1
WD
X
VIEW D-D
G1
0.010 (0.25) ^S T L-M ^S N ^S
A
0.007(0.180) M T L-M S N S
R
Z
0.007(0.180) M T L-M S N S
H
0.007(0.180) M T L-M S N S
J
E
K1
C
G
0.004 (0.10)
-T- SEATING
K
PLANE
G1
VIEW S
0.010 (0.25) S T L-M S N S
F
0.007(0.180) ^M T L-M ^S N ^S
VIEW S
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940198). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.685 0.695
B 0.685 0.695
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G
0.050 BSC
H 0.026 0.032
J 0.020
K 0.025
R 0.650 0.656
U 0.650 0.656
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y
0.020
Z
2°
10°
G1 0.610 0.630
K1 0.040
MILLIMETERS
MIN MAX
17.40 17.65
17.40 17.65
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
0.64
16.51 16.66
16.51 16.66
1.07
1.21
1.07
1.21
1.07
1.42
0.50
2°
10°
15.50 16.00
1.02
Figure 14-3. MC68HC705C8AFN Package Dimensions (Case #777)
Technical Data
194
Mechanical Specifications
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MC68HC705C8A — Rev. 3