English
Language : 

M14D128168A Datasheet, PDF (14/59 Pages) Elite Semiconductor Memory Technology Inc. – Internal pipelined double-data-rate architecture; two data access per clock cycle
ESMT
M14D128168A (2M)
Operation Temperature Condition (TC) -40°C~95°C
column. {The less half-pulse width distortion present, the larger the tQH value is; and the larger the valid data eye will be.}
Examples:
a. If the system provides tHP of 1200 ps into a DDR2-800 SDRAM, the DRAM provides tQH of 900 ps minimum.
b. If the system provides tHP of 1300 ps into a DDR2-800 SDRAM, the DRAM provides tQH of 1000 ps minimum.
8. RU stands for round up. WR refers to the tWR parameter stored in the MRS.
9. When the device is operated with input clock jitter, this parameter needs to be de-rated by the actual tERR (6-10per) of the
input clock. (output de-ratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-800 SDRAM has tERR (6-10per)(min.) = - 272 ps and tERR (6-10per)(max.) =
+ 293 ps, then tDQSCK (min.)(derated) = tDQSCK (min.) - tERR (6-10per)(max.) = -350 ps - 293 ps = -643 ps and tDQSCK (max.)
(derated) = tDQSCK (max.) - tERR (6-10per)(min.) = 350 ps + 272 ps = +622 ps. Similarly, tLZ (DQ) for DDR2-800 de-rates to
tLZ (DQ)(min.)(derated) = -800 ps - 293 ps = -1093 ps and tLZ (DQ)(max.)(derated) = 400 ps + 272 ps = +672 ps.
10. When the device is operated with input clock jitter, this parameter needs to be de-rated by the actual tJIT (per) of the input
clock. (output de-ratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-800 SDRAM has tJIT (per)(min.) = - 72 ps and tJIT (per)(max.) = + 93 ps,
then tRPRE (min.)(derated) = tRPRE (min.) + tJIT (per)(min.) = 0.9 x tCK (avg) - 72 ps = + 2178 ps and tRPRE (max.)(derated) =
tRPRE (max.) + tJIT (per)(max.) = 1.1 x tCK (avg) + 93 ps = + 2843 ps.
11. When the device is operated with input clock jitter, this parameter needs to be de-rated by the actual tJIT (duty) of the input
clock. (output de-ratings are relative to the SDRAM input clock.)
For example, if the measured jitter into a DDR2-800 SDRAM has tJIT (duty)(min.) = - 72 ps and tJIT (duty)(max.) = + 93 ps,
then tRPST (min.)(derated) = tRPST (min.) + tJIT (duty)(min.) = 0.4 x tCK (avg) - 72 ps = + 928 ps and tRPST (max.)(derated) =
tRPST (max.) + tJIT (duty)(max.) = 0.6 x tCK (avg) + 93 ps = + 1593 ps.
12. Refer to the Clock Jitter table.
13. ODT turn on time min is when the device leaves high impedance and ODT resistance begins to turn on.
ODT turn on time max is when the ODT resistance is fully on. Both are measured from tAOND.
14. ODT turn off time min is when the device starts to turn off ODT resistance.
ODT turn off time max is when the bus is in high impedance. Both are measured from tAOFD.
15. When the device is operated with input clock jitter, this parameter needs to be de-rated by the actual tERR (6-10per) of the
input clock. (output de-ratings are relative to the SDRAM input clock.)
16. When the device is operated with input clock jitter, this parameter needs to be derated by { - tJIT (duty)(max.) - tERR
(6-10per)(max.) } and { - tJIT (duty)(min.) - tERR (6-10per)(min.) } of the actual input clock. (output deratings are relative to
the SDRAM input clock.)
For example, if the measured jitter into a DDR2-800 SDRAM has tERR (6-10per)(min.) = - 272 ps, tERR (6- 10per)(max.) = +
293 ps, tJIT (duty)(min.) = -96 ps and tJIT (duty)(max.) = + 94 ps, then tAOF(min.)(derated) = tAOF(min.) + { - tJIT (duty)(max.) -
tERR (6-10per)(max.) } = -400 ps + { - 94 ps - 293 ps} = -787 ps and tAOF(max.)(derated) = tAOF(max.) + { - tJIT (duty)(min.) -
tERR (6-10per)(min.) } = 1000 ps + { 96 ps + 272 ps } = +1368 ps.
17. For tAOFD of DDR2-800/1066, the 1/2 clock of tCK in the 2.5 x tCK assumes a tCH (avg), average input clock HIGH pulse width
of 0.5 relative to tCK (avg). tAOF (min.) and tAOF (max.) should each be derated by the same amount as the actual amount of
tCH (avg) offset present at the DRAM input with respect to 0.5.
For example, if an input clock has a worst case tCH (avg) of 0.48, the tAOF (min.) should be derated by subtracting 0.02 x tCK
(avg) from it, whereas if an input clock has a worst case tCH (avg) of 0.52, the tAOF (max.) should be derated by adding 0.02
x tCK (avg) to it. Therefore, we have;
tAOF (min.)(derated) = tAC (min.) - [0.5 - Min(0.5, tCH (avg)(min.))] x tCK (avg)
tAOF (max.)(derated) = tAC (max.) + 0.6 + [Max(0.5, tCH (avg)(max.)) - 0.5] x tCK (avg)
or
tAOF (min.)(derated) = Min(tAC (min.), tAC (min.) - [0.5 - tCH (avg)(min.)] x tCK (avg))
tAOF (max.)(derated) = 0.6 + Max(tAC (max.), tAC (max.) + [tCH (avg)(max.) - 0.5] x tCK (avg)), where:
tCH (avg)(min.) and tCH (avg)(max.) are the minimum and maximum of tCH (avg) actually measured at the DRAM input balls.
18. tDAL [nCLK] = WR [nCLK] + tnRP [nCLK] = WR + RU {tRP [ps] / tCK (avg) [ps] }, where WR is the value programmed in the
mode register set.
19. tDAL = WR + RU{ tRP[ns] / tCK [ns] }, where RU stands for round up. WR refers to the tWR parameter stored in the MRS. For
tRP, if the result of the division is not already an integer, round up to the next highest integer. tCK refers to the application
clock period.
Example: For DDR2-800 (5-5-5) at tCK =2.5ns with WR programmed to 6 clocks.
tDAL = 6 + (12.5 ns / 2.5 ns) clocks = 6 + 5 clocks = 11 clocks.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2014
Revision : 1.0
14/59