BCM4390DKWBGT Datasheet, PDF (76/78 Pages) Cypress Semiconductor – WICED™ Wi-Fi IEEE 802.11 b/g/n SoC with Embedded Application Processor

BCM4390 Advance Data Sheet
Mechanical Information
Figure 18: WLCSP Keep-Out Areas for PCB Layout—Bottom View, Bumps Facing Up
Note: Top-layer metal is not allowed in the keep-out areas.
BROADCOM ®
February 5, 2014 • 4390-DS103-R
WICED Wi-Fi IEEE 802.11 SoC w/Embedded App Processor
Page 75
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