BCM4390DKWBGT Datasheet, PDF (39/78 Pages) Cypress Semiconductor – WICED™ Wi-Fi IEEE 802.11 b/g/n SoC with Embedded Application Processor

BCM4390 Advance Data Sheet
Pinout and Signal Descriptions
Section 9: Pinout and Signal Descriptions
Ball Maps
Figure 11 shows the WLCSP bump map.
Figure 11: 286-Bump WLCSP (Bottom View, Bumps Facing Up)
BROADCOM ®
February 5, 2014 • 4390-DS103-R
WICED Wi-Fi IEEE 802.11 SoC w/Embedded App Processor
Page 38
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